1550nm Hybrid 3D stack InGaAs LiDAR sensor

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Introduction

DX517是一款專門為人眼安全打造的堆疊封裝遠(yuǎn)距離探測(cè)LiDAR芯片。其SPAD采用基于大芯半導(dǎo)體核心知識(shí)產(chǎn)權(quán)的銦鎵砷材料，可以在1550nm波段實(shí)現(xiàn)高探測(cè)效率。該芯片將銦鎵砷材料工藝的感光wafer和傳統(tǒng)硅工藝的Logic wafer進(jìn)行混合型堆疊封裝。該芯片可以使用在自動(dòng)駕駛汽車、無人機(jī)等各種遠(yuǎn)距離應(yīng)用。

Features

1550nm InGaAs SPAD
Hybrid 3D Stack
300m long distance detection
3D LiDAR technology with high sensitivity SPAD detection
Delivers high SNR, wide dynamic range and no multi-path reflections
10um x 10 um BSI pixels
200 x600 SPAD Detection And Ranging pixels
Fast on-chip histogram processing
Sub-nanosecond light pulse
Sunlight on-chip rejection filter and algorithm
Programmable Repetition rate